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Micron-Level Precision Positioning for Electronics & Semiconductor Equipment

Precision positioning systems for packaging, die-attach, AOI and test handlers - C3 ground screws, P-class guides and rigid supports for ±3µm accuracy.

Industry Context & Technical Challenges

Electronics and semiconductor equipment (die bonders, wire bonders, AOI optical inspectors, test handlers, pick-and-place) are high-precision, high-speed, high-reliability machines. Typical XY platform requirements: positioning within ±3µm, repeatability ±1.5µm, 500-1000mm/s speed, 1-2g acceleration, 24/7 running and MTBF ≥ 10,000 hours. Ordinary C7 rolled screws and standard guides cannot meet these demands; ground screws and high-precision guides with system-level matching are required.

Precision Positioning System

For electronics and semiconductor positioning, Shiyi Automation provides:

C3 ground ball screws - SFAR series, lead accuracy ±0.008mm/300mm, preload P2 (heavy) to fully remove axial play; shaft diameter 12-25mm and lead 5-10mm chosen from load and speed;
P-class linear guides - TRH-V high-assembly square blocks, class P (running parallelism ≤ 0.005mm), preload Z0 (light) or Z1 (medium); rail width 15-25mm by load;
High-rigidity supports - BK fixed side (matched angular-contact bearings, high axial rigidity) and BF supported side (deep-groove, allows thermal expansion); mounting faces precision-ground for screw/rail parallelism;
Zero-backlash couplings - flex-disc couplings with zero backlash, high rigidity and low inertia to transfer servo motion precisely and improve system response;
Precision lock nuts - YSA series with axial runout ≤ 0.003mm, anti-loosening design for frequent start-stop.

Accuracy Assurance

Screw preload adjustment (axial play ≤ 0.002mm before shipment), rail parallelism guidance (two rails parallel within 0.005mm/1000mm), system accuracy verification with laser interferometer support and compensation advice, and temperature control (≤ 2°C rise over 8 hours at high speed).

Typical Application

A Shenzhen packaging OEM built a die bonder requiring ±3µm positioning, ±1.5µm repeatability, 800mm/s, 1.5g and 30kg load; an imported C5 screw with standard guides fluctuated ±5-8µm and ±3µm repeatability. Switching to MOSIONX: C3 SFAR1605 (preload P2) + TRH15 (class P, preload Z1) + BK12/BF12 supports + flex-disc coupling. Measured: positioning ±2.2µm, repeatability ±1.0µm, ≤ 1.2°C over 8 hours, noise ≤ 52dB, and factory pass rate rose from 85% to 98%.

Service

Dedicated technical support for semiconductor customers - selection design, accuracy verification, installation and commissioning guidance, lubrication planning and spare parts. Original-quality assurance with traceable batches; common sizes in stock at Huizhou.

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