C3/C5 ground-grade screws, high-rigidity guides and ball splines for semiconductor packaging, AOI inspection and CMM - micron-level positioning for demanding precision equipment.
Semiconductor equipment (wafer handling, chip packaging, AOI inspection) and precision metrology instruments (CMM, optical vision measurers, laser interferometers) demand micron to sub-micron positioning accuracy, repeatability and smooth motion. Ordinary C7 rolled screws cannot meet these demands; C3/C5 ground screws paired with high-rigidity guides are required. Key targets: positioning accuracy ≤ ±5µm/300mm, repeatability ≤ ±2µm, noise ≤ 55dB, and low temperature rise (≤ 2°C over long runs).
For semiconductor and precision metrology applications, Shiyi Automation recommends:
A Suzhou semiconductor inspection OEM built a chip AOI machine requiring XY positioning ±3µm, repeatability ±1.5µm and 500mm/s. Their previous C5 screws fluctuated ±5-8µm in practice. After switching to a MOSIONX C3 ground screw (SFAR1605, preload P2) with TRH15 P-class guides: positioning stabilised within ±2.5µm; repeatability ±1.2µm; noise reduced from 62dB to 53dB; ≤ 1.5°C temperature change over 8 hours.
We provide end-to-end support for precision equipment - screw preload adjustment guidance, rail parallelism checks, system accuracy verification and lubrication planning - with original-quality assurance and traceable batch management.
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